The module computes the values of T4 (the external thermal resistance to the cable) using the finite element method and then the ampacity (or operating temperature) of the cable installation is obtained using the IEC standardized solution method. The module presents a unique solution combining standard and non-standard calculation methods. The Multiple Duct Banks and Backfills add-on module (MDB) is designed to determine the steady-state ampacity of cables installed in several neighboring duct banks and/or backfills with different thermal resistivity. All types of sheath bonding arrangements for flat and triangular formations are supported with explicit modeling of minor section lengths, unequal cable spacing, etc.Multiple cables per phase with accurate modeling of the sheath mutual inductances which greatly influence circulating current losses and thus de-rates the ampacity of cables.Cyclic loading patterns as per IEC-60853©.Different cable types within one installation.Modeling of cables in air on riser poles, groups of cables in air, moisture migration, nearby heat sources and heat sinks, etc.Independent libraries and databases for cables, duct-banks, load curves, heat sources and installations.Pipe-type cables directly buried or in a thermal backfill.
Different cable installation conditions such as directly buried, thermal backfill, underground ducts or duct banks.This includes single-core, three-core, belted, pipe-type, submarine, sheathed, and armored cables This facility can be used to modify existing cables data and enrich the cable library with new ones.
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